US Industrial Co.,Ltd
|
Place of Origin: | Zhejiang, China (Mainland) |
Add to My Favorites | |
HiSupplier Escrow |
HAL / ENIG Alloy 0.5 - 3oz Copper Routing, Punching Aluminum Pcb With Immersion Tin
Description:
Aluminum board is Low alloyed Al-Mg-Si with high plasticity alloy plate. It has good thermal conductivity, electrical insulation properties and mechanical processing properties. Aluminum plate compares with the traditional FR4 material ,it use the same thickness and same line width. but Aluminum plate can stand higher current. it also can withstand voltage up to 4000v. Thermal conductivity is greater than 2.0. Aluminum material is given priority in the industry at present.
Layer |
1-10 |
Material |
FR4 |
Thickness |
0.6-3.2mm |
Surface finishing |
HAL/ENIG |
Copper |
0.5-3oz |
Test |
Electrical Test |
Specifications:
Product Technical Parameter |
|||
Basic technology |
Parameter |
||
Single/Double sided |
Multilayer |
||
Number of Layers |
1-2 |
4~16 |
|
Copper Thickness |
0.25~3.0OZ |
0.5~3.0OZ |
|
Base Board Thickness |
0.6~3.2mm |
0.6~3.2mm |
|
Incombustibility |
94V-0 |
94V-0 |
|
Peelable resistance |
12.3N/cm |
12.3N/cm |
|
Twist |
≤0.5% |
≤0.5% |
|
Insulation resistance |
≥1011Ω |
≥1011Ω |
|
Test voltage |
10-300V |
10-300V |
|
Finished board area |
560×970mm |
560×970mm |
|
Min. Line Width and Spacing |
0.1/0.1mm |
0.1/0.1mm |
|
|